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NOTICE OF INTENT TO SOLE SOURCE -- A set of wire bonders consisting of one (1) gold wire ball bonder and one (1) heavy wire bonder, both equipped with pull testers and options for manual or semi-automatic control.
| Agency: | DEPT OF DEFENSE |
|---|---|
| Level of Government: | Federal |
| Category: |
|
| Opps ID: | NBD00159393012457585 |
| Posted Date: | Jul 11, 2023 |
| Due Date: | Jul 18, 2023 |
| Solicitation No: | W911QX-23-Q-0129 |
| Source: | https://sam.gov/opp/8f36f75f77... |
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Active
Contract Opportunity
Notice ID
W911QX-23-Q-0129
Related Notice
Department/Ind. Agency
DEPT OF DEFENSE
Sub-tier
DEPT OF THE ARMY
Major Command
AMC
Sub Command
ACC
Sub Command 2
ACC-CTRS
Sub Command 3
ACC-APG
Office
W6QK ACC-APG ADELPHI
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- Contract Opportunity Type: Combined Synopsis/Solicitation (Original)
- All Dates/Times are: (UTC-04:00) EASTERN STANDARD TIME, NEW YORK, USA
- Original Published Date: Jul 11, 2023 05:13 pm EDT
- Original Date Offers Due: Jul 18, 2023 11:59 am EDT
- Inactive Policy: 15 days after date offers due
- Original Inactive Date: Aug 02, 2023
-
Initiative:
- None
- Original Set Aside: 8(a) Sole Source (FAR 19.8)
- Product Service Code: 3670 - SPECIALIZED SEMICONDUCTOR, MICROCIRCUIT, AND PRINTED CIRCUIT BOARD MANUFACTURING MACHINERY
-
NAICS Code:
- 334515 - Instrument Manufacturing for Measuring and Testing Electricity and Electrical Signals
-
Place of Performance:
Adelphi , MD 20783USA
The Army Research Laboratory requires a set of wire bonders with the following characteristics.
The heavy wire bonder shall meet the following minimum requirements:
- Produce wedge-wedge heavy wire bonds
- Process aluminum from 200 to 500 micrometer
- Feature both manual and semi-automatic modes to reduce training requirements of technicians and engineers
- Semi-automatic mode will include a programmable y-axis and z-axis
- Feature a color-display with with settings able to be saved to an internal harddrive
- Include pull tester for bond head with force range 200 - 1000 grams
- Have an adjustable bondforce from 500 to 1800 centinewton
- Have options for ribbon bonding
- Workbench/table-top form factor
- Compatible with 120 V, 60 Hz power
- Include shipping, starter wire sets, and technician installation
The gold ball bonder shall meet the following minimum requirements:
- Produce ball-wedge loop wire bonds
- Process au wires from 17.5 to 50 micrometer
- Capable of copper wire bonding
- Feature both manual and semi-automatic modes to reduce training requirements of technicians and engineers
- Semi-automatic mode will include a programmable z-axis
- Include ball, wedge, bump, stitch and ribbon modes, with stitch being programmable in semi-automatic mode, on one bond head
- Feature a color-display with with settings able to be saved to an internal harddrive
- Include pull tester for bond head with force range up to 30 grams
- Have options for ribbon bonding
- Feature a digitally controlled heated stage
- Have an adjustable bondforce from 15 to 150 centinewton and programmable frequencies/times
- Workbench/table-top form factor
- Step precision of 1 micrometer, industry standard
- Feature a digitally controlled heated stage
- Compatible with 120 V, 60 Hz power
- Include shipping, starter wire sets, and technician installation
Attachments/Links
Contracting Office Address
- KO BLDG 102 AMSSB ACC 2800 POWDER MILL RD
- ADELPHI , MD 20783-1197
- USA
Primary Point of Contact
- Thomas Jurgens
- thomas.c.jurgens.ctr@army.mil
Secondary Point of Contact
- Lee E. Troope
- lee.e.troope.civ@army.mil
- Phone Number 3013941090
- Jul 11, 2023 05:13 pm EDTCombined Synopsis/Solicitation (Original)
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